Price: €60 per attendees (inc VAT)
Photonic Integrated Circuits (PICs) have seen significant investments in fundamental research over the past twenty years. These investments are now being translated into commercial opportunities across a wide range of markets, from compact communications devices to medical diagnostics and sensors, all designed for mass markets.
However, significant manufacturing challenges remain, ensuring integrated photonic devices can be produced at affordable prices and in high volumes. Furthermore, the manufacturing supply chain needs to collaborate more effectively, from design and foundry, through to packaging and test. This symposium brings together key stakeholders to review the current and future status of the manufacturing supply chain.
The symposium will include detailed reviews, given by industry experts, of critical technology challenges, new developments and future opportunities for high-volume manufacturing of integrated photonic devices. The symposium will also provide attendees with an opportunity to participate in an interactive panel session. The symposium is especially suited to those interested in providing Photonic Integrated Circuit manufacturing services and to the users of these services.
12:00 - 13:00 - On-Site Registration & Badge Collection, The Conference Hub
12:45 - 13:00 - Welcome refreshments, Minerva Room
13:00 - 13:15 - Welcome & Opening Remarks -
Peter O'Brien (PIXAPP Director)
13:15 - 13:45 - Development & Manufacturing of a Fully Integrated Silicon Photonic Transceiver Product - Sven Otte (Sicoya)
13:45 - 14:10 - PIC Design Tools - Twan Korthorst (Synopsys)
14:10 - 14:35 - From Prototype to Production Designs: Challenges and Solutions - Iñigo Artundo (VLC Photonics)
14:35 - 15:00 - Transfer Printing for Silicon PIC Manufacturing - David Gomez (X-Celeprint)
15:00 - 15:25 - Manufacturing of InP PICs - Luc Augustin (SmartPhotonics)
15:30 - 16:00 - Coffee Break, Minerva Room
16:00 - 16:25 - Pilot-Scale PIC Packaging – Padraic Morrissey (PIXAPP)
16:25 - 16:50 - Automated PIC Testing - Paul Mooney (Tokyo Electron)
16:50 - 17:15 - PIC Assembly & Packaging Equipment - Ignazio Piacentini (ficonTEC)
17:15 - 17:35 - Technology Roadmap for Integrated Photonics - Lionel Kimerling (MIT & AIM Photonics)
17:35 - 18:15 - Panel Session - Moderator: Jose Pozo (European Photonics Industry Consortium)
18:15 - 20:00 - Evening Reception at Intercontinental Hotel