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7th International Symposium for Optical Interconnect in Data Centres

Tuesday 24 September 2019 | Hall 6, RDS

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7th International Symposium for Optical Interconnect in Data Centres

Tuesday 24 September 2019 | Hall 6, RDS

Session 1: opitcal interconnects for data centres

09:00 - The path to memory-driven computing - Terry Morris, HPE Labs
09:15 - Optical switching in data centers: Light at the end of the tunnel - Hitesh Ballani, Microsoft
09:30 - Optical interconnects for future radio systems - Francesco Testa, Ericsson
09:45 - System innovations in DCI optical transport - Loukas Paraschis, Infinera
10:00 - Scaling datacenter networks with photonic integration - Elad Mentovich, Mellanox
10:15 - Rack-scale disaggregation: does optics make sense? - Laurent Schares, IBM
10:30 - Panel Discussion
10:45 - Coffee break

Session 2: Bring quatum communications into data centres

11:15 - Quantum network connections using semiconductor entangled light emitters - Mark Stevenson, Toshiba
11:30 - Towards a silicon photonics platform for quantum communications and quantum computing - Ségolène Olivier, CEA-LETI
11:45 - The development of QKD Technology in BT - Andrew Lord, British Telecom
12:00 - Dynamically switched QKD networking to secure distributed systems - George Kanellos, University of Bristol
12:15 - Can we transfer analogue coherent optics of access networks to the realm of datacenters? - Bernhard Schrenk, Austrian Institute of Technology
12:30 - Lunch break

Session 3: Photonic technologies for data centre interconnects

13:30 - Si photonics base chip scale 100Gbps optical transceiver "Optical I/O core" for wide temperature range - Kazuhiko Kurata, AIOCore
13:45 Takaaki Ishigure, Keio University
14:00 - TeraPHY: A chiplet technology for low-power, high-bandwidth in-package optical I/O - Mark Wade, Ayar Labs
14:15 - Photonic integrated circuits for data center interconnects - Annika Dochhan, ADVA
14:30 - Innovations in optical packaging for high volume manufacture of optical interconnects - Kobi Hasharoni, DustPhotonics
14:45 - Technological advancement in photonic integrated circuits interconnects - Bernard Lee, Senko
15:00 - Develop your custom photonic integrated circuit for optical interconnects; technology selection and design & validation - Katarzyna Ławniczuk, Bright Photonics
15:15 - Coffee break

Session 4: Next generation computing

15:45 - Nanoseconds photonic integrated switches for optical data center networks - Nicola Calabretta, Eindhoven University of Technology
16:00 - Reimagining the architecture of data center networks with optical switching and burst-mode technologies - Ibrahim Salah, NTT
16:15 - Bandwidth steering for flexible deep disaggregation in data centers - Keren Bergman, Columbia University
16:30 - Silicon photonic transceiver and routing technologies for datacom and computercom interconnects - Theoni Alexoudi, Aristotle University of Thessaloniki
16:45 - Holistic transformation enabling the mass manufacturing of Tb/s data centre transceivers - Bogdan Sirbu, Fraunhofer IZM
17:00 - Graphene photonics for low cost and high-speed datacenter interconnects - Daniel Schall, AMO
17:15 - Panel discussion
17:45 - End of symposium


Tolga Tekin Fraunhofer IZM, Germany
Nikos Pleros Aristotle University of Thessaloniki, Greece
Richard Pitwon Resolute Photonics, United Kingdom
Dimitris Apostolopoulos Institute of Communications and Computer Systems / National Technical University of Athens, Greece
Paraskevas Bakopoulos Mellanox Technologies Ltd., Israel


The focus of this symposium is the evolution of high-performance, low-energy and low-cost optical and photonic interconnect technologies for data communications.

We intend to draw out and discuss the key technology enablers and inhibitors to widespread commercial proliferation of photonic interconnect in mega data centre environments and throughout the wider Internet of Things (IoT) all the way to the "Edge", and how the optical interconnect community can collectively help to address these.

This technology evolution is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader IoT space and the emergence of a new technology eco-system.

The topics addressed will include passive and active embedded optical and photonic interconnect technologies for data centre and IoT including photonic integrated circuits (III-Vs, silicon, polymer, photonic crystals, plasmonics), optical circuit boards, optical transceivers and switches, sensors and the advanced data centre architectures, which these technologies enable.

The projected increase in capacity, processing power and bandwidth density in data centre environments must be addressed by the migration of high density optical interconnect into the data communication enclosures. The conversion point between electrical to optical interconnects will move ever closer to the on-board processing complexes, whether these be CPUs, data storage controllers, FPGAs, routers or switches. This migration is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader ICT space and the emergence of a new technology eco-system.

Motivated by recent breakthroughs and emerging technologies in short reach optical interconnect and the evolution of data centre architectures, this symposium aims to highlight the latest achievements on optical system solutions and architectures, that are placing photonics among the key enabling technologies of datacom and computercom evolution.

Organised through the H2020-Projects on Optical Interconnects:
H2020-L3MATRIX ( )
H2020-COSMICC ( )
H2020-MASSTART ( ) is focusing on Large Scale Silicon Photonics Matrix for Low Power and Low Cost Data Centers

Concurrently, disaggregation and virtualization trends in the DC are forcing the traffic to be between servers and storage elements in the east-west direction. These changes require massive switching capabilities from the discrete switch elements. However, the technology is rapidly reaching a limit. The result is a multi-layered DC topology with high power consumption and long latency. The L3MATRIX project provides novel technological innovations in the fields of silicon photonics (SiP) and 3D device integration. The project will develop a novel SiP matrix with a scale larger than any similar device with more than 100 modulators on a single chip and will integrate embedded laser sources with a logic chip thus breaking the limitations on the bandwidth-distance product.

A novel approach will be used with embedded III-V sources on the SOI substrate which will eliminate the need to use an external light source for the modulators. L3MATRIX provides a new method of building switching elements that are both high radix and have an extended bandwidth of 25 Gb/s in single mode fibres and waveguides with low latency. The power consumption of DC networks built with these devices is 10-fold lower compared to the conventional technology. The outcome of this approach is that large networks, in the Pb/s scale can be built as a single stage, non-blocking network.  is focusing on Silicon Photonics Transceiver and Routing technologies for High-End Multi-Socket Server Blades with Tb/s Throughput interconnect interfaces

This is where ICT-STREAMS steps in, aiming to develop a radically new optical technology for direct chip-to-chip, board level interconnection paradigm that overcomes the current limitations of server-board designs. ICT-STREAMS targets the deployment of a holistic mid-board transceiver and router device portfolio exploiting silicon photonic technologies and introducing WDM both as a capacity-enhancing as well as a low-energy routing mechanism. It aims to deliver a 1.6 Tb/s mid-board transceiver together with a 25.6 Tb/s-throughput mid-board routing engine onto the same electro-optic PCB, releasing a point-to-point-linked 16-socket server board, increasing server-board density and throughput by >400% and 1600% respectively, with 10 fold reduced energy consumption. is focusing on CMOS Solutions for Mid-board Integrated transceivers with breakthrough Connectivity at ultra-low Cost

The COSMICC consortium gathers key industrial and research partners with world-leading positions in the fields of Silicon Photonics, CMOS electronics, Packaging, Optical transceivers and Data center player around a strong vision: mass commercialization of Silicon photonics based transceivers is possible starting in 2019 by enhancing the existing photonic integration platform of ST-Microelectronics. COSMICC will develop optical transceivers that will be packaged on-board. Combining CMOS electronics and Si-photonics with innovative-high-throughput fiber-attachment techniques, the developed solutions are scalable to meet the future data-transmission requirements in data-centers and Super computing systems. With performances improved by an order of magnitude as compared with current VCSELs transceivers, COSMICC developed technology will answer tremendous market needs with a target cost per bit that the traditional WDM transceivers cannot meet. The early setting up of a new value chain will enable exploitation of the developed technologies. is focusing on Mass Manufacturing Of Transceivers For Terabit/S Era

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade. MASSTART will surpass the cost metric threshold by using enhanced and scalable techniques.

H2020-L3MATRIX and H2020-ICT-STREAMS and H2020-COSMICC and H2020-MASSTART projects are supporting and sponsoring the 7th International Symposium for Optical Interconnect in Data Centres.                  MASSTART Project - Logo
L3MATRIX, ICT-STREAMS, COSMICC and MASSTART projects are co-funded by the Horizon 2020 Framework Programme of the European Union within the initiative of the Photonics Public Private Partnership.

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