ECOC header

7th International Symposium for Optical Interconnect in Data Centres

Tuesday 24 September 2019 | Hall 6, RDS

View technical
programme >
Register your
place >
Book your
accommodation >
Huawei

Platinum sponsor

Tektronix

E-Poster sponsor

ADVA

Bronze sponsor

Infineria

Bronze sponsor

Keysight Technologies

Bronze sponsor

Discovery Semiconductors

Bronze sponsor

Discovery Semiconductors

Prize sponsor

 

 

Tuesday 24 September 2019 | Hall 6, RDS

08:30 - Registration

Session 1: Optical Interconnects for DataCenters

09:00 - Terry Morris, HPE Labs
09:15 - Hitesh Ballani, Microsoft
"Optical switching in data centers: Light at the end of the tunnel"
09:30 - Francesco Testa, Ericsson
09:45 - Loukas Paraschis, Infinera
10:00 - Elad Mentovich, Mellanox
10:15 - Panel Discussion
10:30 - 11:00 - Coffee break

Session 2: Bringing Quantum communications into DataCenters?

11:00 - Laurent Schares, IBM
"Rack-scale disaggregation: does optics make sense? "
11:15 - Mark Stevenson, Toshiba
"Quantum network connections using semiconductor entangled light emitters"
11:30 - Andrew Lord, British Telecom
11:45 - George Kanellos, University of Bristol
12:00 - Bernhard Schrenk, Austrian Institute of Technology
"Can we transfer analogue coherent optics of access networks to the realm of datacenters? "
12:15 - Panel Discussion
12:30 -13:30 Lunch break

Session 3: Photonic Technologies for DataCenter Interconnects

13:30 - Kazuhiko Kurata, AIOCore
"Si photonics base chip scale 100Gbps optical transceiver "Optical I/O core" for wide temperature range "
13:45 - Bernard Lee, Senko
14:00 Mark Wade, Ayar Labs
"TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O"
14:15 - Benjamin Wohlfeil, ADVA
14:30 - Kobi Hasharoni, DustPhotonics
14:45 - Takaaki Ishigure, Keio University
15:00 - 15:30 - Coffee break

Session 4: Next-generation computing

15:30 - Bogdan Sirbu, Fraunhofer IZM
"Holistic transformation to enable the mass manufacturing of Tb/s transceivers"
15:45 - Ibrahim Salah, NTT
"Reimagining the architecture of Data Center networks with optical switching and burst-mode technologies"
16:00 - Keren Bergman, Columbia University
"Bandwidth Steering for Flexible Deep Disaggregation in Data Centers"
16:15 - Theoni Alexoudi, Aristotle Univ. Thessaloniki
16:30 - Nicola Calabretta, Eindhoven University of Technology
16:45 - Ségolène Olivier, CEA-LETI
"Towards a silicon photonics platform for quantum communications and quantum computing"
17:00 - END OF SYMPOSIUM

The focus of this symposium is the evolution of high-performance, low-energy and low-cost optical and photonic interconnect technologies for data communications. We intend to draw out and discuss the key technology enablers and inhibitors to widespread commercial proliferation of photonic interconnect in mega data centre environments and throughout the wider Internet of Things (IoT) all the way to the "Edge", and how the optical interconnect community can collectively help to address these.

This technology evolution is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader IoT space and the emergence of a new technology eco-system.

The topics addressed will include passive and active embedded optical and photonic interconnect technologies for data centre and IoT including photonic integrated circuits (III-Vs, silicon, polymer, photonic crystals, plasmonics), optical circuit boards, optical transceivers and switches, sensors and the advanced data centre architectures, which these technologies enable.

The proliferation of mobile data applications is causing a dramatic shift in the location in which data is stored from client based or mobile storage to Cloud data centres with projections that around 60% of all data will be stored in the Cloud by 2020.

The projected increase in capacity, processing power and bandwidth density in data centre environments must be addressed by the migration of high density optical interconnect into the data communication enclosures. The conversion point between electrical to optical interconnects will move ever closer to the on-board processing complexes, whether these be CPUs, data storage controllers, FPGAs, routers or switches. This migration is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader ICT space and the emergence of a new technology eco-system.

This technology migration is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader ICT space and the emergence of a new technology eco-system. Motivated by recent breakthroughs and emerging technologies in short reach optical interconnect and the evolution of data centre architectures, this symposium aims to highlight the latest achievements on optical system solutions and architectures, that are placing photonics among the key enabling technologies of datacom and computercom evolution.

We intend to draw out and discuss the key technology enablers and inhibitors to widespread commercial proliferation of photonic interconnect in "mega" data centre environments and how the optical interconnect community can collectively help to address these.

The topics addressed will centre on passive and active embedded photonic interconnect technologies including optical circuit boards, polymer and glass waveguides, III-Vs, silicon photonics, photonic crystals and plasmonics in data centers.

Organisers:

Tolga Tekin, Fraunhofer IZM, Germany
Nikos Pleros, AUTH, Greece
Richard Pitwon, Resolute Photonics, United Kingdom
Dimitris Apostolopoulos, ICCS/NTUA, Greece
Paraskevas Bakopoulos, MELLANOX, Israel

Organised trough the H2020-Projects on Optical Interconnects:

H2020-L3MATRIX (www.l3matrix.eu )
H2020-ICT-STREAMS (www.ict-streams.eu )
H2020-MASSTART (www.masstart.eu )

L3Matrix.eu is focusing on Large Scale Silicon Photonics Matrix for Low Power and Low Cost Data Centers

Concurrently, disaggregation and virtualization trends in the DC are forcing the traffic to be between servers and storage elements in the east-west direction. These changes require massive switching capabilities from the discrete switch elements. However, the technology is rapidly reaching a limit. The result is a multi-layered DC topology with high power consumption and long latency. The L3MATRIX project provides novel technological innovations in the fields of silicon photonics (SiP) and 3D device integration. The project will develop a novel SiP matrix with a scale larger than any similar device with more than 100 modulators on a single chip and will integrate embedded laser sources with a logic chip thus breaking the limitations on the bandwidth-distance product.

A novel approach will be used with embedded III-V sources on the SOI substrate which will eliminate the need to use an external light source for the modulators. L3MATRIX provides a new method of building switching elements that are both high radix and have an extended bandwidth of 25 Gb/s in single mode fibres and waveguides with low latency. The power consumption of DC networks built with these devices is 10-fold lower compared to the conventional technology. The outcome of this approach is that large networks, in the Pb/s scale can be built as a single stage, non-blocking network.

ICT-STREAMS.eu  is focusing on Silicon Photonics Transceiver and Routing technologies for High-End Multi-Socket Server Blades with Tb/s Throughput interconnect interfaces

This is where ICT-STREAMS steps in, aiming to develop a radically new optical technology for direct chip-to-chip, board level interconnection paradigm that overcomes the current limitations of server-board designs. ICT-STREAMS targets the deployment of a holistic mid-board transceiver and router device portfolio exploiting silicon photonic technologies and introducing WDM both as a capacity-enhancing as well as a low-energy routing mechanism. It aims to deliver a 1.6 Tb/s mid-board transceiver together with a 25.6 Tb/s-throughput mid-board routing engine onto the same electro-optic PCB, releasing a point-to-point-linked 16-socket server board, increasing server-board density and throughput by >400% and 1600% respectively, with 10 fold reduced energy consumption.

MASSTART.eu will focus on Mass Manufacturing Of Transceivers For Terabit/S Era